Maintains contact pressure even when generating heat from high current! A high-performance copper alloy with excellent stress relaxation characteristics.
The "EFTEC-550/EFCUBE series" is a high-performance copper alloy for connector terminals. The "EFTEC-550 series" features high conductivity and excellent stress relaxation properties, making it suitable for high current applications such as power connectors. The "EFCUBE series" has high strength, low Young's modulus, and good bendability, making it suitable for ultra-small board-to-board connectors. 【Features】 ■ Advantages of high conductivity and excellent stress relaxation properties - Maintains contact pressure even when generating heat under high current - Resistant to resistive heating, allowing for thinner (smaller) designs ■ Advantages of high strength and low Young's modulus - Allows for greater deflection, making it less likely to disengage and improving reliability - Minimal change in contact pressure even with variations in plug dimensions or wear *For more details, please refer to the PDF document or feel free to contact us.
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basic information
■EFTEC-550 Series - High conductivity - Excellent stress relaxation characteristics ■EFCUBE Series - High strength - Low Young's modulus - Good bendability *For more details, please refer to the PDF document or feel free to contact us.*
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【Applications】 ■EFTEC-550 Series: High current applications such as power connectors ■EFCUBE Series: Ultra-compact board-to-board connectors *For more details, please refer to the PDF materials or feel free to contact us.
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In this registration information, we will introduce products related to electrical and electronic materials from the six business segments of Furukawa Electric. Our business consists of conductive materials (including winding wires) and copper strips/high-performance materials, primarily engaged in the manufacturing and sales of copper products for electric wires, automotive parts, and electronic device materials. With the increase in shared information and knowledge driven by "electrification," "automated driving," "IoT," and "AI" in the automotive market, the market for communication devices, sensors, control devices, passive components, and more is expanding, requiring diverse characteristics in materials. We will leverage our long-cultivated material and technological capabilities to provide value proposals tailored to our customers' needs.