For improving the reliability of power semiconductors! Oxygen-free copper strips that are easy to inspect and can suppress chip delamination.
"GOFC" is a high-purity oxygen-free copper that is resistant to grain growth even when heated, and its low Young's modulus helps suppress chip delamination. It is intended as an alternative to standard oxygen-free copper for applications involving heat, such as power semiconductor substrates. Since it has the same composition as standard oxygen-free copper, it is easy to substitute, and it suppresses the "grain growth (coarsening)" that is a weakness of oxygen-free copper during heating. Additionally, the low Young's modulus reduces thermal stress caused by differences in thermal expansion rates between the substrate and the chip, resulting in a reliable product with less likelihood of delamination at the bonding surface. 【Features】 - Resistant to grain growth even when heated, reducing background noise during automatic inspection with cameras (improved signal-to-noise ratio). - Low Young's modulus minimizes the generation of thermal stress, suppressing chip delamination. - Suitable for heat dissipation materials such as heat sinks and heat spreaders. *For more details, please refer to the PDF document or feel free to contact us.*
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For more details, please refer to the PDF document or feel free to contact us.
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【Applications】 ■ AMB substrates and resin substrates ■ Heat sinks ■ Heat spreaders, etc. *For more details, please refer to the PDF document or feel free to contact us.
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In this registration information, we will introduce products related to electrical and electronic materials from the six business segments of Furukawa Electric. Our business consists of conductive materials (including winding wires) and copper strips/high-performance materials, primarily engaged in the manufacturing and sales of copper products for electric wires, automotive parts, and electronic device materials. With the increase in shared information and knowledge driven by "electrification," "automated driving," "IoT," and "AI" in the automotive market, the market for communication devices, sensors, control devices, passive components, and more is expanding, requiring diverse characteristics in materials. We will leverage our long-cultivated material and technological capabilities to provide value proposals tailored to our customers' needs.
