High thermal conductivity, high-performance oxygen-free copper "GOFC"

For improving the reliability of power semiconductors! Oxygen-free copper strips that are easy to inspect and can suppress chip delamination.

"GOFC" is a high-purity oxygen-free copper that is resistant to grain growth even when heated, and its low Young's modulus helps suppress chip delamination. It is intended as an alternative to standard oxygen-free copper for applications involving heat, such as power semiconductor substrates. Since it has the same composition as standard oxygen-free copper, it is easy to substitute, and it suppresses the "grain growth (coarsening)" that is a weakness of oxygen-free copper during heating. Additionally, the low Young's modulus reduces thermal stress caused by differences in thermal expansion rates between the substrate and the chip, resulting in a reliable product with less likelihood of delamination at the bonding surface. 【Features】 - Resistant to grain growth even when heated, reducing background noise during automatic inspection with cameras (improved signal-to-noise ratio). - Low Young's modulus minimizes the generation of thermal stress, suppressing chip delamination. - Suitable for heat dissipation materials such as heat sinks and heat spreaders. *For more details, please refer to the PDF document or feel free to contact us.*

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