"Non-contact soldering" meets high quality demands and mass production. A soldering device with non-contact and localized heating, currently under patent application. *Free sample processing available.
The IH soldering device "S-WAVE" enables non-contact and localized heating in confined spaces through heating technology. It eliminates the risk of re-melting surrounding solder areas, allowing for high-quality and efficient soldering of high-density printed circuit boards. It is suitable for production processes with high quality demands and is appropriate for mass production. *Compatible with terminals ranging from φ0.3 to 1.5mm. ～ Documents summarizing case studies and technical information are currently available! ～ You can view them immediately from the [PDF Download] link below. < Common Issues with Soldering > ◎ The running costs for adjusting or replacing consumable parts are burdensome... ◎ There are quality issues due to variability and burdens from rework processes... ◎ We want to improve yield... ◎ We want to solder in narrow areas that cannot be done manually... ◎ We want to switch from batch soldering to inline production... ◎ It is difficult to balance skill development and quality... ⇒ These concerns can be resolved with the "IH Soldering Device S-WAVE"! ★ If you would like to request sample processing or a demonstration with a demo machine, please feel free to contact us.
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【Adoption Scenes】 ◆ To improve maintenance and reduce the frequency of production line stoppages due to soldering work ◆ Due to the aging of manual soldering workers, stable work has become difficult ◆ There are soldering tasks that are challenging with existing methods → We can propose improvements to existing methods, as well as tasks that can only be performed with our product! 【Features】 ■ Compatible with terminals ranging from φ0.3 to 1.5mm ■ Contributes to the automation of manual soldering and reduction of cycle time ■ Minimal consumables, low maintenance, and low running costs ■ Rapid heating with high output even in hard-to-heat areas ■ High-precision and high-speed soldering is achievable ■ Automatic alignment and post-heating treatment are possible ■ No waste solder produced, reducing power consumption for low environmental impact ■ Control of IH power output allows for customizable heating characteristics for each point ■ For terminals with φ0.6mm and copper thickness of 70μm, heating time is 3 seconds per point *For more details, please refer to the PDF document. If you would like to request sample processing or a demonstration with a demo unit, please contact us through the inquiry form.
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*For more details, please refer to the materials. Feel free to contact us as well.*
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![[Technical Information + Case Study Materials] IH Automatic Soldering Equipment 'S-WAVE' Realizing OEE Improvement and CT Reduction](https://image.mono.ipros.com/public/catalog/image/01/14a/676239/IPROS6146597397331539944.jpeg?w=120&h=170)
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