Electrodes used in the manufacturing of electro-galvanized steel sheets and electrodes mainly used for the production of beverage cans!
In electric plating lines such as EGL, ETL, and TFSL, our diffusion bonding technology is used in "plating electrodes," which are utilized by many customers. At EGL, we offer electrodes such as "Electric Zinc Plating Electrode (Lead Alloy)" using various lead alloys as discharge materials, and "Electric Zinc Plating Electrode (Iridium Oxide)" using iridium oxide as discharge material. Additionally, we also provide "Tin Plating Electrode" for ETL and "Chrome Plating Electrode" for TFSL. 【Features】 ■ Electric Zinc Plating Electrode (Lead Alloy) - Electrode using various lead alloys as discharge materials - Used in the production of electric zinc plated steel sheets ■ Electric Zinc Plating Electrode (Iridium Oxide) - Electrode using iridium oxide as discharge material *For more details, please refer to the PDF materials or feel free to contact us.
Inquire About This Product
basic information
【Other Features】 ■ Tin-plated Electrode - Used in the production of tinplate steel sheets ■ Chrome-plated Electrode - Mainly used in the production of steel sheets for beverage cans *For more details, please refer to the PDF document or feel free to contact us.
Price range
Delivery Time
Applications/Examples of results
For more details, please refer to the PDF document or feel free to contact us.
catalog（1）
Download All Catalogs
Company information
Tobata Seisakusho Co., Ltd. was established in 1948 in Tobata as a specialized manufacturer of copper and copper alloys, and has relocated its base to the Sone area of Kokura Minami Ward over half a century ago. We manufacture copper products for blast furnaces and electric furnaces for steel manufacturers both domestically and globally. In recent years, we have successfully developed flame-retardant magnesium alloys, which are gaining attention as lightweight materials aimed at reducing environmental impact, and we are also challenging ourselves in new fields.
![[Press Bending Processing Example] 'Electrode' Copper C1100](https://image.mono.ipros.com/public/product/image/9dc/2001132688/IPROS44403505411890601527.png?w=280&h=280)
![[Research Material] Global Market for Through-Silicon Via (TSV) Technology](https://image.mono.ipros.com/public/product/image/746/2001459948/IPROS04867393473260718247.jpeg?w=280&h=280)
![[Analysis Case] Evaluation of Contact Electrodes for SiC Power MOSFETs](https://image.mono.ipros.com/public/product/image/4db/2000246050/IPROS8112764493184329498.jpg?w=280&h=280)
