Manufacturing of die bonders and wire bonders that are wear-resistant, strong against thermal displacement, and durable for long-term use.
We manufacture tools for wire bonders and die bonders used in semiconductor back-end manufacturing equipment. We can accommodate small lot production and prototypes starting from just one piece. We specialize in precision machining of cemented carbide, prototypes, and single items, and we also accept manufacturing and development from design, so please feel free to consult with us. 【Our Strengths】 ■ We possess cemented carbide processing technology ■ Capable of small lot production ■ Engaged in research and development *For more details, please download the PDF or feel free to contact us.
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【Manufactured Items】 ■ Wind Clamps ■ Heat Combs ■ Porous Heat Combs ■ Plates and others *For more details, please download the PDF or feel free to contact us.
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*For more details, please download the PDF or feel free to contact us.*
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Our company is a manufacturer of semiconductor manufacturing tools located in Yonezawa City, Yamagata Prefecture. We specialize in precision machining of cemented carbide, leveraging this strength to develop a new mold called "Porous Cemented Carbide Mold" aimed at providing higher quality and more efficient products. Using this technology, we have successfully molded thick sections of super engineering plastics, specifically polyimide, which has been difficult to produce until now. We are making proposals that create new value for advanced fields such as automotive and aerospace.