Using a sample board, we will implement the BGA! I will explain each defect!
This time, we will introduce examples of defects found in X-ray inspections. For each defect, we will also explain the state before implementation and provide photos taken with a microscope. Our company also offers "inspection only" services using X-ray and microscopes. We can inspect not only BGA but also QFN, CSP, LGA, etc., and we can accommodate even a single piece, so please feel free to consult with us. You can view detailed information through the related links, so please take a look. 【Examples of defects in X-ray inspections】 ■ Solder shorts ■ Ball dropouts ■ Ball defects ■ Solder flow (shorts) *For more details, please refer to the PDF materials or feel free to contact us.
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Our company was founded in 1990 with four members. At the time of our establishment, we had no equipment, and each of us primarily worked on renovation projects and manual assembly with just a soldering iron. As the miniaturization of components progressed and the number of prototype and development projects involving BGA increased, so did the demand for BGA reballing and jumper wiring. Therefore, we introduced BGA rework equipment before implementing basic devices such as reflow ovens. Since then, we have conducted extensive research in technology alongside numerous customers, and we take pride in having established a level of reliability that satisfies our clients, not only for BGA but also for LGA, POP, underfill applications, and 0402 chip mounting. Other features of our company include the establishment of a RoHS-compliant factory, maintaining a constant inventory, and providing mounting support for cut parts (My Data), which differentiates us from other companies in the same industry. It is our mission to respond to all QCD (Quality, Cost, Delivery) requirements necessary for development and prototype assembly, and we are committed to providing technical support with customer satisfaction as our top priority.