[Precision Cutting Processing Example] Manifold for Teflon Semiconductor Manufacturing Equipment
The warp is about 0.2mm! In addition to a unique cutting process, a heat treatment called annealing is performed!
We would like to introduce a machining case of a manifold made of PTFE (Teflon) for semiconductor manufacturing equipment. Out of a thickness of 96mm, 72mm has been machined, with wall thickness on both sides being 5mm. Normally, when PTFE (Teflon) is machined in its raw form, it tends to warp significantly, and for a manifold of this size, it can warp by about 1mm to 2mm. Since there were instructions to minimize warping as much as possible for this warp-prone PTFE (Teflon), our company has implemented a unique machining method along with a heat treatment called annealing, which keeps the warping to about 0.2mm. 【Case Overview】 ■ Name: Manifold for semiconductor manufacturing equipment made of Teflon ■ Material: PTFE (Teflon) ■ Dimensions: 80×88×96 ■ Precision: Warping within 0.2mm ■ Features: Deep machining with minimal warping *For more details, please refer to the related link page or feel free to contact us.
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【Usage】 ■ Resin Precision Cutting Processing *For more details, please refer to the related link page or feel free to contact us.
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