Kingdy, suitable for embedded systems, can be equipped with 7th/6th generation socket LGA1151 Core i7/i5/i3/Celeron CPUs.
Features ■ Width 230 × Height 255 × Depth 88 mm, 5.16 liters ■ BOOK size chassis ■ 7th/6th generation socket LGA1151 Core i7/i5/i3/Celeron CPU (TDP maximum 65W) ■ 8 USB3.0 / 4 USB3.0 + 4 USB2.0, 1 RS232/RS422/RS485 + 4 RS232, 4 GLAN, 1 DP, 2 DVI-D ■ 1 PCIe [x16], 1 Mini PCI-E ■ Wall mount compatible
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basic information
Specifications ■CPU: 7th/6th Generation Socket LGA1151 Core i7/i5/i3/Celeron CPU (TDP Max 65W) ■Chipset: Q170 Express ■Memory: DDR4-2400/2133 SODIMM x 2, Max 32GB ■H/W Monitor: Watch Dog Timer 256 Level ■TPM: Infineon SLB9665TT 2.0 ■Storage: 2.5" SATA HDD/SSD x 2, M.2 M Key (PCIe x4, SATA3.0) 2280/2242 x 1 ■I/O Connectors: USB3.0 x 8, RS232/422/485 x 1, RS232 x 4, GLAN x 4, DP x 1, DVI-D x 2 ■Expansion Slots: PCIe [x16] x 1 (TDP Max 75W), Mini PCI-E x 1 ■Input Power: DC Input 12V–24V (3PIN Terminal Block) ■Operating Temperature: 0 ~ 50°C ■Dimensions/Weight: 230(W) x 255(H) x 88(D) mm / 2.5 kg
Price information
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Delivery Time
※The delivery date may vary depending on the quantity, so please feel free to contact us.
Applications/Examples of results
For embedded systems
Line up（5）
| Model number | overview |
|---|---|
| TB078SW04064 | Q170 Express, 4GB DDR4, 2.5 |
| TB078SW04500 | Q170 Express, 4GB DDR4, 2.5 |
| TB079SW04064 | H110 Express, 4GB DDR4, 2.5 |
| TB079SW04500 | H110 Express, 4GB DDR4, 2.5 |
| Option | External antenna, 3.5 |
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Company information
Currently, Taiwan has become a global supply base for industrial electronic equipment, and we aim to contribute to the development of Japanese industry by providing excellent industrial electronic equipment from Taiwan to Japanese engineers. As a specialized trading company for industrial electronic equipment, we will supply the necessary industrial electronic devices (LCD displays, LCD modules, embedded PCs, AI embedded PCs, panel PCs, CPU boards, measurement and control boards, network devices, video equipment, GPS devices, wireless transmission devices, IoT sensors) to engineers.