Measurement of film thickness in extremely small areas is now possible! Film thickness is calculated from the intensity of characteristic X-rays generated during electron beam irradiation.
We conduct thickness distribution measurements of thin films using EPMA. Thickness measurements of thin films are primarily performed using X-ray fluorescence and X-ray reflectivity methods. Since these methods use X-rays as the incident source, they can only measure the average thickness over a relatively wide measurement area. In contrast, by utilizing electron beams, we are now able to measure the thickness in extremely small areas (approximately 1μm²) and also perform thickness distribution mapping, so please make use of this capability. 【Features】 ■ Measurement principle: Thickness is calculated from the intensity of characteristic X-rays generated during electron beam irradiation. ■ Equipment used: EPMA ■ Spatial resolution: Approximately 1μm ■ Maximum measurable thickness: Approximately 1μm ■ Minimum mapping area: Approximately 80×80μm *For more details, please refer to the related links or feel free to contact us.
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[Measurement Examples] ■Cu sputter film on Si substrate ■Au thin film on stainless steel plate *For more details, please refer to the related links or feel free to contact us.*
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【Purpose】 ■Measurement of film thickness distribution of thin films using EPMA *For more details, please refer to the related links or feel free to contact us.
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Daitō Analysis Research has been advancing the establishment of an advanced think tank based on highly reliable analysis and analytical techniques accumulated in various material fields, as well as the challenges received from a wide range of industry customers. We aim to solve our customers' various issues with the least cost and the shortest delivery time. Moving forward, we would like to support our customers' research and development using the latest equipment and advanced manpower, and assist in creating products that enrich the future.