High-efficiency insulation structure (inner jacket)! Prevents chip standing by balancing far infrared rays and warm air!
We would like to introduce our new reflow model, the "VFR Series." With a special far-infrared panel heater and hot air circulation method, it enables temperature profile settings comparable to hot air reflow. Additionally, it improves wettability and suppresses voids, preventing chip standing, flying, and misalignment through hot air balance. 【Features】 ■ Special far-infrared panel heater and hot air circulation method ■ Dual configuration of single lane ■ High-efficiency insulation structure reduces heat loss (furnace surface temperature below approximately 40°C) ■ Low nitrogen consumption (below 1000ppm at 250NL/min) ■ Water-cooled radiator cooling mechanism *For more details, please refer to the PDF document or feel free to contact us.
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【Specifications (Partial)】 ■External dimensions: 6510 (L) × 1060 (W) × 1440 (H) ■Pass line: 900 ± 20mm ■Conveying speed: 0.2 to 1.6m/min ■Supported substrate dimensions: 50mm to 400mm (W) × 100mm to 400mm (L) ■Component height: 20mm above the substrate / 20mm below *For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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In the 1980s, surface mount components that responded to the miniaturization of electronic products emerged, and we designed and sold "adhesive curing devices" to coincide with the sale of adhesives for temporarily fixing chip components. We also established a double wave flow soldering method and designed and sold "flow soldering devices compatible with mixed chip components," using Koki flux, which maintains high soldering quality. In the 1990s, with the spread of the concept of environmental conservation, there was a demand for mounting technologies in the manufacturing processes of electronic products that do not adversely affect the environment. To respond to this background, we engaged in the development of solder flow methods applicable to no-clean flux for electronic substrates and the design and sale of "alternative fluorocarbon cleaning devices" compatible with non-fluorocarbon cleaning. In recent years, to meet the demand for "lead-free soldering methods" since 1998, we have been striving to develop technologies for lead-free "flow soldering devices," "reflow devices," and "partial/local dip devices" that can ensure soldering quality on par with conventional "tin/lead solder mounting."