Introducing our equipment information. A diverse lineup including surface grinders and internal grinders!
We would like to introduce the "machine tools" that we handle. Starting with a surface grinding machine (GS-BMH) with a processing range of 150×400×200H, we offer a variety of machine tools including cylindrical grinders, centerless grinders, and internal grinding machines. Additionally, we also provide measuring instruments such as three-dimensional measuring machines and optical microscopes, so please feel free to consult us when needed. 【Equipment Owned (Partial)】 <Machine Tools> ■ Machining Center ■ Wire Electrical Discharge Machine ■ High-Precision Slicer ■ Laser Marker ■ Ultrasonic Cleaning Machine ■ Surface Hardening Equipment ■ Lapping Machine *For more details, please refer to the PDF document or feel free to contact us.
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basic information
【Other Equipment (Partial)】 <Measuring Instruments> ■ Non-contact fully automatic measurement system ■ Ultra-precision surface shape roughness measuring instrument ■ Surface roughness gauge ■ Measuring microscope ■ Video zoom system ■ Roundness measuring instrument ■ Precision length measuring instrument ■ Laser micrometer ■ Electric micrometer ■ Block gauge *For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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Company information
Since its establishment, Hata Grinding has significantly contributed to the industry by enhancing grinding processing technology to its limits, particularly in the grinding of difficult-to-machine materials such as fine parts, ceramics, glass, nickel alloys, and new materials. Notably, while the average processing precision of grinding machines is 0.001 mm, Hata Grinding has already achieved an unprecedented high precision of 0.0001 mm. We are committed to continuously pursuing new possibilities without being satisfied with the current state, providing reliable technology. This spirit of challenge has led to outstanding results in the development of new areas of grinding materials, including automotive, bearings, low-voltage electronics, and optical communication components.
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