Unique technology that enables fine processing of printed circuit boards.

We will propose solutions tailored to your technical needs! We will respond with our unique technology for fine and thin plate processing, as well as hole processing.

Our company primarily engages in the development, manufacturing, and sales of electronic circuit boards, offering double-sided boards, multilayer boards, and high-density interconnect (HDI) boards on a global scale. By providing consistent production from prototyping to mass production, we achieve high quality, high reliability, and low cost. Additionally, based on the trust and track record we have built over many years, we propose solutions that align with our customers' technical needs. We handle various types of cavity boards suitable for sensor devices, ultra-thin high-density boards with a thickness of 0.0mm, via diameter of Φ0.04mm, and positional accuracy of ±0.025mm that enhance the performance of advanced electronic devices, as well as MSAP high-density boards with a pattern width of 0.01mm and pattern spacing of 0.025mm achieved through selective plating methods. [Shinko Manufacturing's Technology] ■ Thin high-density board processing technology Supports narrow slits, free shapes, coil patterns, undercoating, and step-through holes. ■ Cavity boards Three-dimensional structures can be reproduced even with resin boards. ■ MSAP method Contributes to pattern miniaturization and product downsizing and high density through selective plating methods. *For more details, please refer to the PDF materials or feel free to contact us.

Processing Contract