【January 25 (Wednesday) to 27 (Friday), 2023】 Equipment capable of performing individual piece inspection and overall wafer sensory inspection with a single unit, etc.
Hubbrain Inc. will be exhibiting at the 37th Electro Test Japan held at Tokyo Big Sight. We plan to showcase our "Crack Inspection Device (with AI)", "Wafer Inspection Device", "Line Camera Photometric Stereo", and "Line Camera Type 3D Inspection Device". We sincerely look forward to your visit. 【Exhibited Products】 ■ Crack Inspection Device (with AI) ■ Wafer Inspection Device ■ Line Camera Photometric Stereo ■ Line Camera Type 3D Inspection Device *For more details, please refer to the PDF document or feel free to contact us.
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【Exhibition Overview】 ■Name: 37th Electrotest Japan ■Date: January 25 (Wednesday) - 27 (Friday), 2023, 10:00 AM - 5:00 PM ■Venue: Tokyo Big Sight, East Exhibition Hall ■Booth Number: East Hall 2, 16-48 *For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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At Hube Brain, each employee has a unique personality and is always striving for a higher level of technology. The work of technology development always involves trial and error. We value an environment where we can challenge unknown fields with free thinking, without fearing failure. We believe that adopting a positive mindset in everything, along with a performance-based evaluation system focused on ability and achievements, fosters individual motivation, which leads to good work.