By using nitrogen gas, up to 49% of power consumption can be eliminated! Significant reduction in driving power is possible.
The "N2 IMPACT II" is a nitrogen gas generation device with a built-in compressor that enables significant reductions in driving power due to its energy-saving program. In conventional models, the driving power remained constant even if the usage of N2 gas decreased, but in this series, energy-saving operation can be selected according to the usage flow rate by automatically calculating the N2 gas usage and control process in a stepless manner. Improvements in the N2 generation process have allowed for the use of compressors with the same motor output as existing series, achieving an increase in N2 gas generation by up to 27.3%. 【Features】 ■ Reduction of up to 49% in power consumption based on nitrogen gas usage ■ Up to 27.3% increase in N2 generation ■ Ability to operate the device with external air supply ■ Improved maintainability, reducing effort and costs ■ Adoption of scroll compressors for low vibration and low noise *For more details, please refer to the PDF materials or feel free to contact us.
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basic information
【Lineup】 ■TYPE 2.2kW ■TYPE 3.7kW ■TYPE 5.5kW ■TYPE 7.5kW *For more details, please refer to the PDF document or feel free to contact us.
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Applications/Examples of results
【Uses】 ■ For N2 packaging of food ■ For resin molding ■ For electronic components ■ As a substitute for gas cylinders in factories and laboratories ■ For heat treatment *For more details, please refer to the PDF document or feel free to contact us.
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In the 1980s, surface mount components that responded to the miniaturization of electronic products emerged, and we designed and sold "adhesive curing devices" to coincide with the sale of adhesives for temporarily fixing chip components. We also established a double wave flow soldering method and designed and sold "flow soldering devices compatible with mixed chip components," using Koki flux, which maintains high soldering quality. In the 1990s, with the spread of the concept of environmental conservation, there was a demand for mounting technologies in the manufacturing processes of electronic products that do not adversely affect the environment. To respond to this background, we engaged in the development of solder flow methods applicable to no-clean flux for electronic substrates and the design and sale of "alternative fluorocarbon cleaning devices" compatible with non-fluorocarbon cleaning. In recent years, to meet the demand for "lead-free soldering methods" since 1998, we have been striving to develop technologies for lead-free "flow soldering devices," "reflow devices," and "partial/local dip devices" that can ensure soldering quality on par with conventional "tin/lead solder mounting."
