Achieve an increase in generation with space-saving and energy-saving! Reduce power consumption by up to 26.4% per cubic meter.
The "NE-II Series" is an energy-saving nitrogen gas generation device that achieves a generation capacity of 20-180 Nm3/h with a compact housing design. Through process improvements, the nitrogen generation capacity has been increased by approximately 36.5% compared to conventional models. With the adoption of panel doors, the maintenance space required on the front, back, and sides is only 600mm, eliminating unnecessary installation space and consolidating the maintenance area on the right side of the device. As a result of the increased nitrogen gas generation, the power required to produce 1m3 has been reduced by up to 26.4%. 【Features】 ■ Achieves a generation capacity of 20-180 Nm3/h with a compact housing design ■ Nitrogen generation capacity increased by approximately 36.5% compared to conventional models due to process improvements ■ N2 generation capacity increased by up to 36.5% ■ Power consumption per 1m3 reduced by up to 26.4% ■ Maintenance space on the front, back, and sides is only 600mm due to the adoption of panel doors *For more details, please refer to the PDF document or feel free to contact us.
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【Lineup】 ■TYPE 11K ■TYPE 15K ■TYPE 22K ■TYPE 37K ■TYPE 55K *For more details, please refer to the PDF document or feel free to contact us.
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【Applications】 ■ As a nitrogen supply source for reflow ovens and solder baths ■ As a nitrogen supply source for desiccators, etc. ■ For nitrogen replacement in the packaging of ham, sausages, bonito flakes, cheese, beverages, dressings, etc. ■ For drying resin pellets, preventing product scorching, and preventing scorching on screws, etc. *For more details, please refer to the PDF document or feel free to contact us.
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In the 1980s, surface mount components that responded to the miniaturization of electronic products emerged, and we designed and sold "adhesive curing devices" to coincide with the sale of adhesives for temporarily fixing chip components. We also established a double wave flow soldering method and designed and sold "flow soldering devices compatible with mixed chip components," using Koki flux, which maintains high soldering quality. In the 1990s, with the spread of the concept of environmental conservation, there was a demand for mounting technologies in the manufacturing processes of electronic products that do not adversely affect the environment. To respond to this background, we engaged in the development of solder flow methods applicable to no-clean flux for electronic substrates and the design and sale of "alternative fluorocarbon cleaning devices" compatible with non-fluorocarbon cleaning. In recent years, to meet the demand for "lead-free soldering methods" since 1998, we have been striving to develop technologies for lead-free "flow soldering devices," "reflow devices," and "partial/local dip devices" that can ensure soldering quality on par with conventional "tin/lead solder mounting."