[Report] Global Market for Ball Grid Array (BGA) Packages
Product ID: 1182241 Publisher: Bizwit Research & Consulting LLP
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Ball Grid Array (BGA) packages are a type of surface mount package for integrated circuits that can provide more connection terminals compared to dual in-line packages and flat packages. It is important to fully utilize the bottom surface of the device, resulting in shorter wiring between the package and the die, which excels in high-speed performance. Key factors contributing to the growth of the global Ball Grid Array (BGA) packaging market during the forecast period include the growth of the automotive industry and the increasing demand for consumer electronics.
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Publication Date: December 19, 2022 Publisher: Bizwit Research & Consulting LLP Page Information: English Table of Contents Chapter 1 Executive Summary Chapter 2 Global Market for Ball Grid Array (BGA) Packages: Definition and Scope Chapter 3 Global Market for Ball Grid Array (BGA) Packages: Market Dynamics Chapter 4 Global Market for Ball Grid Array (BGA) Packages: Industry Analysis Chapter 5 Risk Assessment: Impact of COVID-19 Chapter 6 Global Market for Ball Grid Array (BGA) Packages: By Material Type Chapter 7 Global Market for Ball Grid Array (BGA) Packages: By Type Chapter 8 Global Market for Ball Grid Array (BGA) Packages: Regional Analysis Chapter 9 Competitive Information Chapter 10 Research Process *The table of contents and prices for this report are as of the time of publication. For the latest information, please contact us.
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