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  5. Circuit board design and manufacturing
  6. V-groove substrate for fiber array in optical communication

V-groove substrate for fiber array in optical communication

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last updated:Feb 14, 2023

セラテック九州
セラテック九州
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Customizable according to your requirements such as material, shape, and dimensional accuracy. We will respond flexibly from development products to mass-produced products.

V-groove substrate for optical communication fiber arrays High-precision V-groove processing possible with groove pitch deviation of '±0.0003 mm' or less.

    Circuit board design and manufacturing
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V-groove substrate for fiber array in optical communication

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basic information

Work Size and Specifications Material: Tempax, Pyrex, Quartz, Zirconia, Silicon Specifications: Maximum φ200×t2.0mm Groove Pitch: 127μm, 250μm Pitch Deviation: ±0.3μm or less V-Groove Angle: 60° to 100° ±0.5° Measurement: Pitch deviation and shape measurement are performed using a laser heterodyne displacement meter *For other materials and sizes, please inquire separately.

Price range

P1

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Applications/Examples of results

Fiber array Optical splitter (PLC splitter)

Detailed information

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    V-groove processing leaflet

Company information

セラテック九州

セラテック九州

Manufacturing and processing contract

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The Material Processing Service we aim for is positioned between material manufacturers and component device manufacturers, operating independently without relying on specific companies or affiliations, and providing processing technology and services to the market. We specialize in processing services for a wide range of industries and companies, primarily in broad ceramics (inorganic materials other than metals), sintered metals, and semiconductor metals, responding to diverse needs with our unique know-how, high technical capabilities, and a varied processing repertoire. Furthermore, we not only meet customer specifications but also continuously improve the processing processes and actively make proposals that benefit our customers. We view contract processing of electronic optical materials as a solution service and define it as MPS. We maintain an open approach with our customers and ensure thorough disclosure to lower barriers, allowing them to use our services with the same sense as their own factories. We excel in cutting materials and precision grinding to achieve high flatness, and by combining shape processing and polishing, we provide processing technology to the market through in-house integrated processing.

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