High-precision cutting tailored to patterns and dicing cutting for individual pieces is possible.
We perform dicing cutting of plate-shaped materials and high-precision cutting according to patterns using fixed abrasives, diamond blades, etc. In addition to cutting from rectangular and circular shapes to polygons, we can also perform bevel cuts and chamfering. By changing various blades, we can process V grooves, U grooves, and corner grooves. We accommodate various materials, including glass, crystal, and quartz, as well as coated and mirror-finished products. Since we can set arbitrary cutting dimensions, we can respond quickly even for small lot products.
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basic information
Work Size and Specifications Maximum: φ200mm × MAXt5.0mm Minimum Cutting Dimension: 0.3mm and above Cutting Accuracy: ±0.01mm Cutting Allowance: 0.05mm and above Grooving Processing (V-groove, U-groove, Corner groove) - We will process to your desired groove width and shape. Please specify the pitch width, groove depth, and other sizes. - By selecting various blades, we can accommodate U-grooves and corner grooves. - Since processing is done without direct contact with the product, it is also compatible with coated products.
Price range
P1
Delivery Time
Applications/Examples of results
For electronic components, for optical components
Detailed information
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Dicer, Slicer Processing Leaflet
Company information
The Material Processing Service we aim for is positioned between material manufacturers and component device manufacturers, operating independently without relying on specific companies or affiliations, and providing processing technology and services to the market. We specialize in processing services for a wide range of industries and companies, primarily in broad ceramics (inorganic materials other than metals), sintered metals, and semiconductor metals, responding to diverse needs with our unique know-how, high technical capabilities, and a varied processing repertoire. Furthermore, we not only meet customer specifications but also continuously improve the processing processes and actively make proposals that benefit our customers. We view contract processing of electronic optical materials as a solution service and define it as MPS. We maintain an open approach with our customers and ensure thorough disclosure to lower barriers, allowing them to use our services with the same sense as their own factories. We excel in cutting materials and precision grinding to achieve high flatness, and by combining shape processing and polishing, we provide processing technology to the market through in-house integrated processing.