Holocathode Source "HCS"

Electrode spacing can be freely adjusted for process compatibility! Achieving gentle processing with low discharge voltage.

The "HCS" is a surface treatment component characterized by the integration of a hollow cathode and an anode. Electrons are confined between the potential drops of the deep groove walls of the cathode. This promotes gas ionization and increases plasma density. When plasma is pushed into the grooves, a very powerful and bright plasma is generated beneath the electrode plate. With a simple and scalable design, it achieves robust behavior and easy customization. In terms of high-density plasma processing, it is comparable to CCP and ICP, but at a lower cost than ICP. 【Features】 ■ Hollow cathode design, substrate-independent ■ High electron density and ionization efficiency promote high-density radicals ■ Scalable ion source for surface cleaning, activation, and etching purposes ■ Applicable to thin film coating due to specific component design ■ Usable for dynamic and static substrate transport *For more details, please refer to the PDF document or feel free to contact us.

Plasma GeneratorVentilation and Exhaust