4-layer high-density wiring circuit board
Number of layers: Four layers Material: FR-4 Board thickness: 1.57 +/- 0.13 mm Surface treatment: Electroless gold plating Copper foil thickness: H/H~1/1 oz Remark: Impedance control 75 OHM Differential pair: 85/90/100 OHM
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basic information
Generally, high-density multilayer lamination technology is adopted in manufacturing. It increases the available wiring area and enhances wiring density. It reduces the thickness of the insulating medium, thereby decreasing the overall thickness and weight of the printed circuit board. It shortens the length of wire interconnections, reducing electrical signal interference and loss. The relatively small thickness of the vias improves the reliability of interconnections. The structural design of the vias is convenient, allowing for greater design flexibility and improved design efficiency.
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Applications/Examples of results
These include laptop computers and tablet computers, automotive electronics, aerospace, medical devices, wearable electronics, robots, and smart devices.
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Company information
Our company, ExPlus, was established in Taiwan in 1997 and is a specialized manufacturer focusing on printed circuit boards.
