The head part is a magnet, allowing it to be attached to metal parts for temperature measurement.
Magnetically designed for excellent cost performance. Utilizing the adhesive-type temperature sensor ST-50 series, it features a simple structure that allows for easy replacement of the sensor part, resulting in superior cost performance.
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basic information
Sensor Type: K Thermocouple Class 2 (JIS C 1602-1995) Magnetic Force: 3N to 7N (on a flat iron surface) Accuracy: ±2℃ (on a flat magnetic surface at 100℃) Temperature Measurement Range: 0 to 300℃ (without condensation) Response Time: STM-A-P/G-100: 0.5 seconds (90%) typical value STM-A-G-300/500: 1.5 seconds (90%) typical value *Place the sensor in a sufficiently room temperature environment, make instant contact of the sensor's temperature sensing part with a flat magnetic surface at 100℃, and evaluate at 90% of the stable point. Contact Plate Material: SUS304 Head (Body) Material: Liquid Crystal Polymer Sensor Material: STM-A-P-100: Polyimide Resin (using ST-51-100-C) STM-A-G-100/300/500: Glass Non-woven Fabric (using ST-50 / ST-50-300 / ST-50-500) Mass: Approximately 10g
Price range
P1
Delivery Time
Applications/Examples of results
Measurement of the surface temperature of the mold. Measurement of the temperature of the motor body and bearing section.
Detailed information
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Easily connect to the measuring instrument with a dedicated connector cable.
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The sensor unit uses our ST-50 series. It has a simple structure and excellent cost performance.
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Company information
Our company, as a service provider in measurement and control, is engaged in the sale of advanced products and research and development to meet the diverse needs of the industrial sector through hardware (various control instruments such as industrial control devices for temperature, pressure, power, etc., communication converters connected to field networks, control devices specially designed for customer equipment and machinery, sensors for high-precision measurements of temperature, pressure, etc.) + software (proposals to customers, engineering, before-service, after-service, support) + peripheral device solutions.