Improvement of quality in hand soldering and laser soldering with various modes.
We would like to introduce our tabletop selective soldering machine, 'ULTIMA-TRZ', which we manufacture. Since its launch in 2008, this product has received great acclaim, and the latest model is the "ULTIMA-TRZ." It significantly contributes to the streamlining of manual soldering processes when combined with the "ULTIMA-SSP." 【Features】 ■ Replacement of soldering iron processes, reduction of soldering defects ■ One-touch easy operation ■ Space-saving and energy-efficient ■ Suitable for small lot production and cell production of various types ■ Significant increase in production efficiency when combined with ULTIMA-SSP ・Production volume 1300 units/day ⇒ 1500 units/day ・Number of operators 6 ⇒ 2 ・Material 18Kg ⇒ 4Kg (Compared to manual soldering processes) ■ Compatible with the program creation system Freedom (optional) ■ Can be switched to a spare solder pot *For more details, please refer to the PDF document or feel free to contact us.
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【ULTIMA-TRZ Specifications】 ■Dimensions: 940(L) x 620(W) x 442(H)mm ■Weight: Approximately 125Kg ■Supported PCB: Max 250(W) x 330(L)mm, thickness under 2mm ■Nitrogen: 0.4-0.5MPa / 25L/min. ■Nozzle: 2mm to 20mm, 18 sizes available, custom sizes also possible ■Solder tank: 16Kg ■Operation: PCB stage (X - Y - Z) *For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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In the 1980s, surface mount components that responded to the miniaturization of electronic products emerged, and we designed and sold "adhesive curing devices" to coincide with the sale of adhesives for temporarily fixing chip components. We also established a double wave flow soldering method and designed and sold "flow soldering devices compatible with mixed chip components," using Koki flux, which maintains high soldering quality. In the 1990s, with the spread of the concept of environmental conservation, there was a demand for mounting technologies in the manufacturing processes of electronic products that do not adversely affect the environment. To respond to this background, we engaged in the development of solder flow methods applicable to no-clean flux for electronic substrates and the design and sale of "alternative fluorocarbon cleaning devices" compatible with non-fluorocarbon cleaning. In recent years, to meet the demand for "lead-free soldering methods" since 1998, we have been striving to develop technologies for lead-free "flow soldering devices," "reflow devices," and "partial/local dip devices" that can ensure soldering quality on par with conventional "tin/lead solder mounting."