The servo swing spray application mechanism enables uniform flux application without inconsistencies!
The "VIS-400" is a spray flux application device in the wave soldering series that can spray environmentally friendly VOC-free flux. It employs a spray gun capable of ultra-low pressure micro-application. By combining high-speed swing control of a servo motor, it achieves uniform flux application. Furthermore, the adoption of a flux application mechanism from an ultra-close distance eliminates blind spots caused by component heights such as QFP and SOP, allowing for flux application to the back of the leads, significantly improving application efficiency. 【Features】 - Enables uniform flux application - Utilizes a spray gun capable of ultra-low pressure micro-application - Greatly reduces mist scattering and particle rebound outside the substrate - Decreases the amount of flux adhering to the inside of the device - Reduces cleaning maintenance frequency and flux usage, contributing to material cost savings *For more details, please refer to the PDF document or feel free to contact us.
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【Other Features】 - Due to the close distance between the substrate and the nozzle, the kinetic energy of the flux atomization particles is not lost, allowing for application up to the surface of the through-hole. - Achieves good wetting during soldering. *For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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In the 1980s, surface mount components that responded to the miniaturization of electronic products emerged, and we designed and sold "adhesive curing devices" to coincide with the sale of adhesives for temporarily fixing chip components. We also established a double wave flow soldering method and designed and sold "flow soldering devices compatible with mixed chip components," using Koki flux, which maintains high soldering quality. In the 1990s, with the spread of the concept of environmental conservation, there was a demand for mounting technologies in the manufacturing processes of electronic products that do not adversely affect the environment. To respond to this background, we engaged in the development of solder flow methods applicable to no-clean flux for electronic substrates and the design and sale of "alternative fluorocarbon cleaning devices" compatible with non-fluorocarbon cleaning. In recent years, to meet the demand for "lead-free soldering methods" since 1998, we have been striving to develop technologies for lead-free "flow soldering devices," "reflow devices," and "partial/local dip devices" that can ensure soldering quality on par with conventional "tin/lead solder mounting."