[Technical Introduction] Mold for Lens-Equipped Semiconductor Packages

Custom mold designs compatible with existing molding equipment are also possible! We have a proven track record in the production of opto-modules and more! At Rohm Mecatech, we have extensive experience with mold designs for packages with lenses. Through EDM processing, we can achieve a mirror finish of 0.5μRZ (0.7μRy) for semiconductor package areas measuring 30mm square. Using new equipment introduced in each process, our skilled workers meticulously and precisely complete the machining. Additionally, we are committed to using materials with minimal aging changes and high-quality finishes, providing molds designed for long-term use. **Features** - Achieves a mirror finish of 0.5μRZ (0.7μRy) for semiconductor package areas measuring 30mm square through EDM processing. - Utilizes new equipment introduced in each process. - Skilled workers meticulously and precisely complete the machining. - Provides molds designed for long-term use. *For more details, please refer to the PDF document or feel free to contact us.*

Custom mold design compatible with existing molding equipment is also possible! We have a track record of producing opto-modules and more! At Rohm Mecatech, we have extensive experience with mold molds for packages with lenses. Through EDM processing, we can achieve a mirror finish of 0.5μRZ (0.7μRy) for semiconductor package sections measuring 30mm square. Using new equipment introduced in each process, our skilled workers meticulously and accurately complete the machining. Additionally, we focus on materials with minimal aging changes and high-quality finishes, providing molds designed for long-term use. **Features** - Achievable mirror finish of 0.5μRZ (0.7μRy) for semiconductor package sections measuring 30mm square through EDM processing - Utilization of new equipment introduced in each process - Skilled workers meticulously and accurately complete the machining - Molds designed for long-term use *For more details, please refer to the PDF document or feel free to contact us.*

Custom mold designs compatible with existing molding equipment are also possible! We have a track record of producing opto-modules and more! At Rohm Mecatech, we have extensive experience with mold designs for packages with lenses. Through EDM processing, we can achieve a mirror finish of 0.5μRZ (0.7μRy) on semiconductor package sections measuring 30mm square. Using new equipment introduced in each process, our skilled workers meticulously and precisely complete the machining. Additionally, we focus on materials with minimal aging changes and high-quality finishes, providing molds designed for long-term use. **Features** - Achievable mirror finish of 0.5μRZ (0.7μRy) on semiconductor package sections measuring 30mm square through EDM processing - Utilization of new equipment introduced in each process - Skilled workers meticulously and precisely complete the machining - Molds designed for long-term use *For more details, please refer to the PDF document or feel free to contact us.*

Custom mold design compatible with existing molding equipment is also possible! We have a track record of producing opto-modules and more! At Rohm Mecatech, we have extensive experience with mold designs for packages with lenses. Through EDM processing, we can achieve a mirror finish of 0.5μRZ (0.7μRy) for semiconductor package sections measuring 30mm square. Using new equipment introduced in each process, our skilled workers meticulously and precisely complete the machining. Additionally, we focus on materials with minimal aging changes and high-quality finishes, providing molds designed for long-term use. **Features** - Achievable mirror finish of 0.5μRZ (0.7μRy) for semiconductor package sections measuring 30mm square through EDM processing - Use of new equipment introduced in each process - Skilled workers meticulously and precisely complete the machining - Molds designed for long-term use *For more details, please refer to the PDF document or feel free to contact us.*