The substrate types include alkaline glass and heat-resistant glass! Achieving long, narrow fine hole drilling.
At Musashino Fine Glass, we have developed a technology that performs etching after modifying the glass using lasers. By irradiating with ultra-short pulse lasers, we create regions with different physical properties within the glass, allowing us to etch into the desired shapes. This processing method, which combines "laser" and "etching," enables the realization of long and narrow fine hole drilling that was previously difficult to achieve. 【Examples of Achievements】 ■ Aspect ratio of approximately 5, substrate thickness 0.4mm, hole diameter φ80μm ■ Aspect ratio of approximately 7.5, substrate thickness 0.6mm, hole diameter φ80μm ■ Aspect ratio of approximately 2.8, substrate thickness 0.5mm, hole diameter φ180μm *For more details, please refer to the PDF document or feel free to contact us.
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【Standard Design (Excerpt)】 ■ Usable substrate size: 100×100mm to 370×470mm ■ Usable substrate shapes: Square, Round ■ Substrate thickness: t0.1 to 1.1mm ■ Through hole top diameter: φ20μm and above (varies depending on substrate thickness, hole diameter, and substrate type) ■ Through hole cross-sectional shapes: Straight type, Hourglass type, Tapered type ■ Through hole shapes: Circular, Polygonal, Irregular *For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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Our company performs glass substrate cutting and glass substrate etching processing. We not only accept contract processing but also respond to inquiries regarding processing, and we cater to our customers' needs from prototyping to mass production. Please feel free to contact us if you have any requests.