Composite processing (micro through holes, recessing, etc.)

We will perform a combination of etching using photoresist and microfabrication utilizing laser modification!

We would like to introduce our "composite processing (fine through holes, engraving, etc.)" that we perform. It is possible to use photoresist for the purpose of protecting wiring. A protective layer can be patterned with photoresist on a substrate where wiring has already been completed, allowing for engraving and through-hole processing. Additionally, through-holes processed with laser modification and etching have edges that are nearly vertical, making it easier to insert components. After the through-hole processing, counterboring can be performed to facilitate the insertion of components. 【Processing Examples (Partial)】 ■ Processing for Wiring Protection - Photoresist can be used for the purpose of wiring protection. - A protective layer can be patterned with photoresist on a substrate where wiring has already been completed, allowing for engraving and through-hole processing. - Photoresist can be removed with inorganic or organic alkalis. *For more details, please refer to the PDF materials or feel free to contact us.

Processing ContractGlass