Dicing processing and cutting

Achieving high yield! Active in the production of semiconductor chips and substrates for smartphones, automotive sensors, and IoT devices!

"Dicing processing" involves cutting materials such as ceramics and glass into dice-shaped pieces or creating grooves using a high-speed rotating diamond blade. Chips with individual functions are separated according to the patterns created on semiconductor wafers and substrates. Dicing processing is performed using a dicing machine and appropriate blades tailored to the characteristics of the material and the specifications of the product. The processing position of the material can be recognized on the device, allowing for the cutting of patterned materials. Furthermore, with the ability to read patterns through image recognition, high-precision processing can be achieved while assessing any deformation of the material. **Strengths of Tokyo Electron Industry** - Achieves high precision, high quality, and high yield - Expertise in diamond tools and processing methods - Supports from a minimum of one piece, in-house prototype and mass production - Urgent requests can also be accommodated with a fully integrated in-house system *For more details, please refer to the PDF document or feel free to contact us.*

Processing Contract