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  6. Dicing processing and cutting

Dicing processing and cutting

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last updated:Mar 22, 2023

東京電子工業
東京電子工業
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Achieving high yield! Active in the production of semiconductor chips and substrates for smartphones, automotive sensors, and IoT devices!

"Dicing processing" involves cutting materials such as ceramics and glass into dice-shaped pieces or creating grooves using a high-speed rotating diamond blade. Chips with individual functions are separated according to the patterns created on semiconductor wafers and substrates. Dicing processing is performed using a dicing machine and appropriate blades tailored to the characteristics of the material and the specifications of the product. The processing position of the material can be recognized on the device, allowing for the cutting of patterned materials. Furthermore, with the ability to read patterns through image recognition, high-precision processing can be achieved while assessing any deformation of the material. **Strengths of Tokyo Electron Industry** - Achieves high precision, high quality, and high yield - Expertise in diamond tools and processing methods - Supports from a minimum of one piece, in-house prototype and mass production - Urgent requests can also be accommodated with a fully integrated in-house system *For more details, please refer to the PDF document or feel free to contact us.*

    Processing Contract
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Dicing processing and cutting

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  • Related Link - https://tokyo-denshi.jp/introduction/#in_sec1a

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【Cutting Processing - Types of Processing】 ■ Processing of patterned materials ■ Simultaneous processing of composite materials ■ Integrated processing from large materials to fine products *For more details, please refer to the PDF document or feel free to contact us.

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Applications/Examples of results

【Processing Achievements】 ■Example of dicing processing of glass materials: cutting and chamfering ■Example of processing of high-hardness alumina substrates with cutting and drilling *For more details, please refer to the PDF document or feel free to contact us.

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Tokyo Electronic Industry Company Profile

Tokyo Electronic Industry Company Profile

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東京電子工業

東京電子工業

Manufacturing and processing contract

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Tokyo Electronic Industries is an expert in the processing of ceramics, glass, and composite materials. We can process hard and brittle materials, which are difficult for other companies, with ultra-precision and short delivery times. We have handled over 100,000 processing projects, and whether for prototypes or mass-produced items, we respond to our customers' high-level demands with quality and speed.

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