[Explanation] Electron Beam Powder Bed Melting Method Metal 3D Printer
Calibur
What is the electron beam powder bed fusion method (powder bed fusion)? What is EB-PBF? Let me explain it briefly!
"What is Electron Beam Powder Bed Fusion (EB-PBF)?" "What is EB-PBF?" Let me explain briefly! We provide a schematic diagram explaining Electron Beam Powder Bed Fusion (EB-PBF) for those in charge who have started gathering information on metal 3D printers! The process involves powder supply by a powder dispenser, powder deposition by a recoater (forward motion), vertical movement of the build stage and the recoater's excess powder passage, melting and solidification of the powder by electron beam irradiation, and powder deposition by the recoater (return motion), repeating this series of actions for layered manufacturing. The vertical movement of the build stage and the recoater's excess powder passage help save powder and reduce waste. *The schematic diagram is based on equipment from Wayland Additive and may not necessarily apply to all electron beam powder bed fusion (EB-PBF) metal 3D printers currently sold by various manufacturers.
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【Device Lineup】 ■Calibur 3 【Device Specifications】 ◆ Maximum Build Size Calibur 3: W 300 × D 300 x H 450 mm : W 100 × D 100 x H 150 mm (※ (Material Development Space, Reduction Parts) 【Compatible Materials】 ◆ Ti-6Al-4V ◆ Vibenite280 / 290 Others
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Aerospace, military, power generation, mining, gas and oil, automotive, others
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As a technology trading company, we leverage our years of experience in the sales of various 3D printer devices with different molding methods and semiconductor manufacturing equipment, as well as after-sales maintenance services, to provide our customers with total solutions, including application support. In the field of 3D printer devices, we handle three main types of metal additive manufacturing methods: electron beam powder bed, laser powder bed, and laser deposition, allowing us to make proposals suitable for our customers' applications. We also sell metal powders with high hardness and high wear resistance characteristics for metal 3D printers. Furthermore, in the field of semiconductor manufacturing equipment, we also handle atomic layer deposition (ALD) devices.