Adopting a modular design has increased the flexibility of the production layout! It also contributes to energy savings and reduced environmental impact.
The inline selective soldering device 'SELBO-II' is a new model that inherits the performance of the conventional EQS series and has evolved further. By modularizing the processes of flux application, preheating, and soldering, we have increased the flexibility of the device configuration, making it possible to change layouts after installation and to re-install due to transitions in the production site, which was difficult with typical inline machines. It can accommodate the customer's production style without stress. The quality of soldering, which is particularly important, can achieve high quality and stable soldering as it uses the same soldering pot as the well-regarded TR series. Compared to large inclined soldering devices, it features an energy-saving design that significantly reduces electricity costs and unnecessary material costs (flux, solder), thereby lowering production costs. The device itself generates little heat, contributing to the improvement of the production environment and supporting SDGs. 【Features】 ■ Flexibility in production layout ■ Capable of handling a variety of products and small lot production ■ Stable production guaranteed with a variety of optional features *For more details, please refer to the PDF document or feel free to contact us.
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In the 1980s, surface mount components that responded to the miniaturization of electronic products emerged, and we designed and sold "adhesive curing devices" to coincide with the sale of adhesives for temporarily fixing chip components. We also established a double wave flow soldering method and designed and sold "flow soldering devices compatible with mixed chip components," using Koki flux, which maintains high soldering quality. In the 1990s, with the spread of the concept of environmental conservation, there was a demand for mounting technologies in the manufacturing processes of electronic products that do not adversely affect the environment. To respond to this background, we engaged in the development of solder flow methods applicable to no-clean flux for electronic substrates and the design and sale of "alternative fluorocarbon cleaning devices" compatible with non-fluorocarbon cleaning. In recent years, to meet the demand for "lead-free soldering methods" since 1998, we have been striving to develop technologies for lead-free "flow soldering devices," "reflow devices," and "partial/local dip devices" that can ensure soldering quality on par with conventional "tin/lead solder mounting."