Design is free, and we can accommodate your requests for tape! It is possible to bond different materials with insulating adhesive.
We assist with the application of back tape for lead frames as a primary example of our adhesive processing. In general adhesive processing, the bonding of the same material is common, but by incorporating a polyimide adhesive layer, it is possible to bond dissimilar materials with heat resistance. We also offer suggestions for materials tailored to your specific applications. Additionally, we will check the availability of various tapes, PI films, Teflon sheets, etc., so please feel free to consult with us. 【Benefits of Adhesive Processing】 ■ It is possible to bond dissimilar materials with their respective characteristics: - SUS430 material → imparts magnetism - Cu material → conductivity and heat dissipation - Ti material → corrosion resistance - Ni alloy material → thermal expansion coefficient similar to glass, etc. *For more details, please refer to the related links or feel free to contact us.
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【Attachment Example】 ■Material Used: C1100-H 0.1t + Polyimide + SUS304-HTA 0.1t ■Bonding of stainless steel and copper ・Stainless steel → Strong resistance to rust ・Copper → Excellent conductivity and heat dissipation properties *For more details, please refer to the related links or feel free to contact us.
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For more details, please refer to the related links or feel free to contact us.
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With a motto of small lots, diverse varieties, and short delivery times, we provide high-quality products through a consistent production system from prototype processing to mass production. We offer various proposals from the development stage of semiconductor packages and meet the needs of over 1,000 customers both domestically and internationally through precision processing technology. We aim to be a "department store of processing technology" that can handle all precision processing, primarily focusing on etching, including essential transport tools and carriers used in the manufacturing processes of semiconductors and electronic components.