Low-pressure forming is possible! Molding materials suitable for parts requiring sub-micron level precision.
The "TM-250" is an injection molding epoxy resin material suitable for parts requiring sub-micron level precision. It is applicable for precision mechanical components, resin cases, and device encapsulation. We also offer molding materials such as "TM-261," which enables high dimensional accuracy, and "YD8000T," characterized by ultra-low shrinkage. 【Features】 ■TM-250 ・Can be molded under low pressure ■TM-261 ・High dimensional accuracy ■YD8000T ・Ultra-low shrinkage *For more details, please refer to the PDF document or feel free to contact us.
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【Other Features】 ■TM-250 ・High fluidity, flame retardant ■TM-261 ・High fluidity, low shrinkage, low thermal expansion, flame retardant ■YD8000T ・Low shrinkage, low thermal expansion, flame retardant, high elasticity *For more details, please refer to the PDF document or feel free to contact us.
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【Applications】 ■ Optical communication components ■ Precision mechanism components ■ Pickup components ■ Various insulators *For more details, please refer to the PDF document or feel free to contact us.
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Our company takes pride in our technology that allows us to create products that can finely respond to the diverse needs of our customers in the field of thermosetting resins, and we are continuously engaged in research and development. Specifically, we focus on thermosetting liquid formulations and high-performance thermosetting resin molding materials as our core business, striving to thoroughly pursue market needs while aiming for research and development of new technologies that will serve as a foundation for anticipated trends. Please feel free to contact us if you have any inquiries.