Suitable for transfer, injection, and compression molding! Molding materials that can be formed at around 120°C.
The "KT-17C20" is an epoxy resin molding material for low-temperature, low-pressure molding that enables molding in temperature ranges that were difficult with conventional molding materials. It can be molded at around 120°C, and due to its low-pressure molding capability and high fluidity, productivity is improved without the need for a case. Additionally, since the molding pressure and temperature are low, there is no deformation or damage to the mounted components, making it suitable for the molding and sealing of mounted components that are sensitive to heat and stress. 【Features】 ■ Molding possible at around 120°C ■ Low-pressure molding capability ■ High fluidity ■ Low-temperature curing ■ Ultra-low-pressure sealing *For more details, please refer to the PDF document or feel free to contact us.
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basic information
【Other Features】 ■Curing Properties ・Can be demolded at 120℃ in 3 minutes ■Flexural Strength ・170 MPa ■Flexural Modulus ・20 GPa ■Spiral Flow ・95 cm ■Glass Transition Temperature ・110℃ *For more details, please refer to the PDF document or feel free to contact us.
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Applications/Examples of results
【Applications】 ■ Sealing of two-wheeled vehicle ECUs ■ Bulk sealing of mounted circuit boards ■ Sealing of capacitors *For more details, please refer to the PDF document or feel free to contact us.
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Company information
Our company takes pride in our technology that allows us to create products that can finely respond to the diverse needs of our customers in the field of thermosetting resins, and we are continuously engaged in research and development. Specifically, we focus on thermosetting liquid formulations and high-performance thermosetting resin molding materials as our core business, striving to thoroughly pursue market needs while aiming for research and development of new technologies that will serve as a foundation for anticipated trends. Please feel free to contact us if you have any inquiries.