Low dielectric materials have low radio wave loss! Sealing materials that can be used in communication devices and more.
"U-659A/B" is a low dielectric polyurethane sealing material that achieves a reduction in radio wave loss, which was difficult with conventional sealing materials. It is suitable for sealing high-frequency band sensors and can be used in communication devices and sensor sealing. In addition, while general sealing materials have a high radio wave loss with a relative permittivity of 3.9, this product has a lower dielectric material, resulting in a relative permittivity of 2.7 and reduced radio wave loss. [Features] - Low dielectric - Moisture resistance - Flexibility *For more details, please refer to the PDF document or feel free to contact us.
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basic information
【Physical Property Data】 ■Curing Conditions ・100℃×40min ■Dielectric Loss Tangent (1MHz) ・3.0% ■Relative Permittivity (1MHz) ・2.7 *For more details, please refer to the PDF document or feel free to contact us.
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【Applications】 ■Communication equipment ■Sensor encapsulation *For more details, please refer to the PDF document or feel free to contact us.
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Our company takes pride in our technology that allows us to create products that can finely respond to the diverse needs of our customers in the field of thermosetting resins, and we are continuously engaged in research and development. Specifically, we focus on thermosetting liquid formulations and high-performance thermosetting resin molding materials as our core business, striving to thoroughly pursue market needs while aiming for research and development of new technologies that will serve as a foundation for anticipated trends. Please feel free to contact us if you have any inquiries.
