For industrial embedded systems, 11th/10th generation Intel Core i9/i7/i5/i3 CPUs, supporting extended temperature range -20 to 60° C.
Features ■ Width 224 × Height 63 × Depth 199 mm ■ Equipped with 11th/10th generation Intel Core i9/i7/i5/i3/Pentium/Celeron CPU ■ Fanless operation ■ 2× DDR4 2933/2666/2400MHz SDRAM SO-DIMM (up to 64GB) ■ 4K resolution support, 2 HDMI, 1 DP output ■ Operating temperature range -20 to 60° C ■ Expansion slots support 1× M.2 E-key (2230, PCIex1/USB2.0), 1× M.2 B-key (3042/3052, PCIex1/USB3.0) ■ Supports 8× USB, 2× RJ45, 1× Line-out, 1× Mic, 1× DP, 2× HDMI, 4× COM (Max)
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basic information
Specifications ■CPU: 11th/10th Generation Intel Core i9/i7/i5/i3/Pentium/Celeron CPU ■Chipset: Intel Q470E Express chipset ■Memory: 2×DDR4 2933/2666/2400MHz SDRAM SO-DIMM (up to 64GB) ■Expansion Slots: 1×M.2 E-key (2230, PCIex1/USB2.0), 1×M.2 B-key (3042/3052, PCIex1/USB3.0) ■IO Interface: 8×USB, 2×RJ45, 1×Line-out, 1×Mic, 1×DP, 2×HDMI, 4×COM (Max) ■Storage: 1×M.2 M-key (2280, PCIex4/SATA interface) ■Power Supply: DC19V/120W Adapter MB: DC12~28V ■Operating Temperature: -20 ~ 60° C ■Dimensions (mm)/Weight (kg): 224mm(W) x 63mm(H) x 199mm(L) / 4kg ■Certifications: CE, FCC, LVD, RoHS, ErP Ready
Price information
Open price
Delivery Time
※It may vary depending on quantity and timing, so please feel free to contact us.
Applications/Examples of results
Machine, factory, building automation/monitoring systems.
Line up（4）
| Model number | overview |
|---|---|
| HB650I02-Q470-B | non-WiFi |
| HB650I02I-Q470-B | WiFi |
| HB650I02-Q470-T | TPM/non-WiFi |
| HB650I02I-Q470-T | TPM/WiFi |
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Company information
Currently, Taiwan has become a global supply base for industrial electronic equipment, and we aim to contribute to the development of Japanese industry by providing excellent industrial electronic equipment from Taiwan to Japanese engineers. As a specialized trading company for industrial electronic equipment, we will supply the necessary industrial electronic devices (LCD displays, LCD modules, embedded PCs, AI embedded PCs, panel PCs, CPU boards, measurement and control boards, network devices, video equipment, GPS devices, wireless transmission devices, IoT sensors) to engineers.