In addition to printed resist, we are implementing innovations using the photo-etching process!
We are performing etching processing on materials that consist of 1.0mm thick copper (Cu) bonded with glass epoxy resin from one side. Hirai Precision Industry has a track record of processing up to 2.0mm thick copper. While copper (Cu) is the mainstream material, aluminum (AL) is also possible. For the insulating layer, we have experience with materials other than glass epoxy resin, including ceramics (aluminum nitride substrates, silicon nitride substrates, etc.), polyimide, and PET film. We often receive materials supplied by customers for etching processing. 【About Etching Processing】 - In addition to printed resist, we employ a photo-etching process for improvements. - This allows for finer finishes and enhanced linearity. - The dimensions of the tapered section of the cross-section can be kept to less than half the thickness of the plate. *For more details, please refer to the PDF document or feel free to contact us.
Inquire About This Product
basic information
【Etching Processing + α Possibilities】 ■ It is possible to remove adhesives (filler materials) used for bonding with the insulating layer. ■ We have a track record of prototype support. ・ Plating (electroless plating) processing necessary for assembly. ・ Processing to roughen the copper surface aimed at achieving an anchor effect. ・ Dicing (cutting) the insulating layer, etc. ■ From the etching method applied from one side, it is possible to create steps in a copper plate shape. * For more details, please refer to the PDF document or feel free to contact us.
Price range
Delivery Time
Applications/Examples of results
For more details, please refer to the PDF document or feel free to contact us.
catalog（1）
Download All Catalogs
Company information
With a motto of small lots, diverse varieties, and short delivery times, we provide high-quality products through a consistent production system from prototype processing to mass production. We offer various proposals from the development stage of semiconductor packages and meet the needs of over 1,000 customers both domestically and internationally through precision processing technology. We aim to be a "department store of processing technology" that can handle all precision processing, primarily focusing on etching, including essential transport tools and carriers used in the manufacturing processes of semiconductors and electronic components.
![[Processing Example] Etching Processing Mirror Material](https://image.mono.ipros.com/public/product/image/e28/2000850437/IPROS36434547853852429383.jpeg?w=280&h=280)
![[Processing Example] Etching Processing Encoder Blackening Treatment](https://image.mono.ipros.com/public/product/image/13e/2000850458/IPROS93042928675124783609.jpeg?w=280&h=280)
![[Processing Example] Power Semiconductor (Power Device) Etching Processing](https://image.mono.ipros.com/public/product/image/d95/2000850621/IPROS44658195744487621775.jpeg?w=280&h=280)
![[Processing Example] Regarding the Fine Residual Width in Etching Processing](https://image.mono.ipros.com/public/product/image/112/2000850802/IPROS77442332386063106799.jpeg?w=280&h=280)
![[Processing Example] Etching Processing, Black Dyeing, Black Treatment](https://image.mono.ipros.com/public/product/image/d64/2000850914/IPROS50884282747553049952.jpeg?w=280&h=280)
![[Processing Reference Example] Casing Screw Machining](https://image.mono.ipros.com/public/product/image/2088546/IPROS16021466541096188662.png?w=280&h=280)