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  5. Processing Contract
  6. [Processing Examples] Etching Fiber Laser Wire Comparison

[Processing Examples] Etching Fiber Laser Wire Comparison

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last updated:May 11, 2023

平井精密工業
平井精密工業
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Comparing etching processing, fiber laser processing, and wire electrical discharge machining! Introducing the advantages.

Hirai Precision Industry specializes in etching processing and also offers machining services such as fiber laser processing and wire electrical discharge machining. We propose processing methods that can meet customer requests and usage purposes. Even for shapes and precision that cannot be achieved with a single processing method, our strength lies in combining etching processing with fiber laser processing and wire processing to aim for the realization of customer projects. 【Advantages of Etching Processing】 ■ Suitable for fine processing of intricate shapes with a thickness of 1.0mm or less ■ Potential cost benefits as the quantity increases ■ Capable of handling everything from single prototypes to mass production of tens of thousands ■ No burrs generated in the thickness direction ■ Less distortion compared to machining ■ Minimal price fluctuations *For more details, please refer to the PDF document or feel free to contact us.

    Processing Contract
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[Processing Examples] Etching Fiber Laser Wire Comparison

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  • Related Link - https://www.hirai.co.jp/case/3607/

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【Other Benefits】 <Fiber Laser Processing> ■ No initial costs for creating original plates used in etching ■ Fast processing speed allows for short delivery times tailored to your requests ■ Suitable for small to mass production with a plate thickness of 0.1mm or more (order quantity to be discussed) ■ Capable of hole processing below the plate thickness (can create a φ0.2mm hole in a 1.0mm thick plate) <Wire Electrical Discharge Machining> ■ No initial costs for creating original plates used in etching ■ Minimal thermal impact during processing helps reduce warping ■ Almost no taper in the cross-section (when processing a 1mm thick plate, the dimensional difference between the front and back is about 0.01μm precision) ■ Can process plates thicker than 4.0mm with high precision (depending on the shape, aiming for less than ±0.02mm is also possible) *For more details, please refer to the PDF document or feel free to contact us.

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Hirai Precision Industry Co., Ltd. "Company Profile"

Hirai Precision Industry Co., Ltd. "Company Profile"

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平井精密工業

平井精密工業

Electronic Components and Semiconductors

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With a motto of small lots, diverse varieties, and short delivery times, we provide high-quality products through a consistent production system from prototype processing to mass production. We offer various proposals from the development stage of semiconductor packages and meet the needs of over 1,000 customers both domestically and internationally through precision processing technology. We aim to be a "department store of processing technology" that can handle all precision processing, primarily focusing on etching, including essential transport tools and carriers used in the manufacturing processes of semiconductors and electronic components.

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