[Processing Example] Etching Process Through-Holes of φ0.05mm or Smaller

It is possible to create fine holes through metal etching processing! We will positively try to implement it.

We would like to introduce a case where we finished fine holes with a diameter of φ0.05mm (50 microns) using our specialty photochemical etching process. We can handle materials such as Cu (copper), AL (aluminum), Fe (iron), and Ni alloys (Kovar, 42 alloy, Amber), as well as special materials like silicon steel sheets. For fine hole processing of materials other than SUS, confirmation through prototyping and testing is necessary. We will consider processing according to your desired material, plate thickness, and required shape. 【Case Study (1) Overview】 ■ Processing Method: Etching ■ Material: SUS304-HTA, Plate Thickness 0.02mm ■ Hole Diameter: 0.025mm to 0.035mm (25 microns to 35 microns) ■ Product Size: φ30mm ■ Number of Sample Holes: 5 *For more details, please refer to the PDF document or feel free to contact us.

Processing Contract