It is possible to create fine holes through metal etching processing! We will positively try to implement it.
We would like to introduce a case where we finished fine holes with a diameter of φ0.05mm (50 microns) using our specialty photochemical etching process. We can handle materials such as Cu (copper), AL (aluminum), Fe (iron), and Ni alloys (Kovar, 42 alloy, Amber), as well as special materials like silicon steel sheets. For fine hole processing of materials other than SUS, confirmation through prototyping and testing is necessary. We will consider processing according to your desired material, plate thickness, and required shape. 【Case Study (1) Overview】 ■ Processing Method: Etching ■ Material: SUS304-HTA, Plate Thickness 0.02mm ■ Hole Diameter: 0.025mm to 0.035mm (25 microns to 35 microns) ■ Product Size: φ30mm ■ Number of Sample Holes: 5 *For more details, please refer to the PDF document or feel free to contact us.
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【Case Study (2) Overview】 ■ Processing Method: Etching ■ Material: SUS304-HTA, Thickness 0.05mm ■ Hole Diameter: 0.05mm (50 microns) ■ Product Size: φ30mm ■ Number of Sample Holes: 20 *For more details, please refer to the PDF document or feel free to contact us.
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[Usage] ■ Optical applications (apertures), filters, masks, etc. *For more details, please refer to the PDF materials or feel free to contact us.
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With a motto of small lots, diverse varieties, and short delivery times, we provide high-quality products through a consistent production system from prototype processing to mass production. We offer various proposals from the development stage of semiconductor packages and meet the needs of over 1,000 customers both domestically and internationally through precision processing technology. We aim to be a "department store of processing technology" that can handle all precision processing, primarily focusing on etching, including essential transport tools and carriers used in the manufacturing processes of semiconductors and electronic components.