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  6. 【UHS_X-ray CT System Imaging Example】 CT Cross-section of Solder Crack

【UHS_X-ray CT System Imaging Example】 CT Cross-section of Solder Crack

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XVA-160RZ Microfocus X-ray CT System

last updated:Oct 05, 2023

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This is a case where a solder crack was detected by performing CT imaging of an interposer substrate using the Micro Focus X-ray CT system XVA-160RZ.

The XVA-160RZ is a versatile 3D X-ray CT system that can be used for quality assurance, failure analysis, and inspection of semiconductors, electronic components, and electronic modules. By utilizing functions such as real-time observation, 3D oblique CT, and orthogonal CT according to the application, it not only advances analysis tasks efficiently but also dramatically improves the success rate of analyses. Additionally, by using the standard program operation function, it can also be employed for product sorting and sampling inspection purposes.

    X-ray inspection equipment
#001_半導体パッケージ内部.jpg

【UHS_X-ray CT System Imaging Example】 CT Cross-section of Solder Crack

#001_半導体パッケージ内部.jpg
#001_半導体パッケージ内部.jpg
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This is a case where the solder bumps of a CPU mounted on a smartphone's circuit board were captured using 3D oblique CT. By performing CT imaging, we were able to detect solder cracks that could not be found through visual observation. The CT imaging was conducted with the circuit board removed from the smartphone. The underside of the CPU has countless chip components mounted on it, and the CPU itself has a three-dimensional structure, making non-destructive analysis generally very difficult. The XVA-160RZ allows for the specification of the imaging area during the visual observation stage through its user-centric function, enabling a transition to 3D oblique CT imaging without removing the sample, thus ensuring that even complex structures like smartphone circuit boards can be imaged without missing the observation area.

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The XVA series has been our best-selling model since its release in 2000, widely adopted by major domestic semiconductor manufacturers, electronic component manufacturers, and EMS manufacturers. By adding orthogonal CT functionality to our core technologies, the user-centric function*1 and 3D oblique CT function, it has become versatile for a wide range of applications. #X-ray #oblique CT #transmission #non-destructive #orthogonal CT #crack #defect #void #foreign matter #solder *1 User-centric function A feature that automatically follows the point of interest when operations such as detector tilt, stage rotation, and magnification changes are performed during fluoroscopic observation. This is our patented technology.

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[UHS_X-ray CT System Imaging Example] CT Cross-section of Solder Crack

[UHS_X-ray CT System Imaging Example] CT Cross-section of Solder Crack

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Testing, Analysis and Measurement

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Our company develops and manufactures non-destructive testing equipment centered around advanced X-ray devices, high-precision stages, and image processing technology. The XVA series, which utilizes a user-centric stage capable of rotational observation around any focal point, accurately meets the needs of customers seeking advanced quality assurance in manufacturing lines and implementation analysis at the nano level. In addition to inspecting printed circuit board soldering implementations, we support research, development, and manufacturing across a wide range of fields, including semiconductor products, various electronic devices, automotive components and related industries, materials and composites, and medical-related areas.

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