【UHS_X-ray CT System Imaging Example】 CT Cross-section of Solder Crack

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This is a case where the solder bumps of a CPU mounted on a smartphone's circuit board were captured using 3D oblique CT. By performing CT imaging, we were able to detect solder cracks that could not be found through visual observation. The CT imaging was conducted with the circuit board removed from the smartphone. The underside of the CPU has countless chip components mounted on it, and the CPU itself has a three-dimensional structure, making non-destructive analysis generally very difficult. The XVA-160RZ allows for the specification of the imaging area during the visual observation stage through its user-centric function, enabling a transition to 3D oblique CT imaging without removing the sample, thus ensuring that even complex structures like smartphone circuit boards can be imaged without missing the observation area.

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The XVA series has been our best-selling model since its release in 2000, widely adopted by major domestic semiconductor manufacturers, electronic component manufacturers, and EMS manufacturers. By adding orthogonal CT functionality to our core technologies, the user-centric function*1 and 3D oblique CT function, it has become versatile for a wide range of applications. #X-ray #oblique CT #transmission #non-destructive #orthogonal CT #crack #defect #void #foreign matter #solder *1 User-centric function A feature that automatically follows the point of interest when operations such as detector tilt, stage rotation, and magnification changes are performed during fluoroscopic observation. This is our patented technology.