The goal is to accommodate large substrates and reduce equipment costs.
Choyo Engineering, as a leading manufacturer of LCD cell gap formation equipment, has developed a new type of "sealing device for organic EL" based on its experience in producing many specialized devices that accommodate various materials and process conditions. This device is characterized by its aim to support future large substrates and reduce equipment costs.
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Contents and Specifications of the Device ● By forming a vacuum double chamber using UV light-transmitting film as a substitute for quartz glass, UV irradiation (curing of UV-curable resin) can be performed on the substrate under atmospheric pressure conditions. ● The use of flexible film and the ease of pressure control applied to the DAM agent enable the optimization of process conditions related to the DAM agent and FILL agent. Additionally, uniform pressure can be applied across the entire substrate, allowing for the production of products with good gap accuracy. ● Main Device Specifications - Substrate loading and unloading: Opening and closing of gate valves, robotic hand, substrate receiving mechanism - Substrate alignment: Alignment based on substrate outline (Option: automatic/manual alignment) - Equipment: UV irradiation lamp, mask mechanism, vacuum pump
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Organic EL
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We solve your problems with bonding and sealing! - We propose a new bonding process that combines vacuum and atmosphere - Bonding of various shapes is possible. Prototyping and demo support are available, so please consult with us. At Joyo Engineering, as a top manufacturer of LCD bonding equipment and LCD cell gap formation equipment, we have produced many specialized devices that cater to various materials and process conditions, responding to our customers' needs. Based on numerous achievements, we have now released a new "vacuum bonding device." This device solves issues such as "air bubble inclusion in decorative panels with steps or slits," "design constraints of 2.5D/3D shapes," and "processing unevenness and positional deviation of thin substrates like films," enabling bonding of various shapes.