In recent years, to address the thermal challenges associated with the miniaturization and high integration of electronic devices, it has excellent thermal conductivity of 38 W/m K in the thickness direction (Z-axis).
VB200 is a thermal interface material (TIM) developed based on special elastomers to address the thermal challenges associated with the miniaturization and high integration of recent electronic devices. It has an excellent thermal conductivity of 38 W/m K in the thickness direction (Z-axis), efficiently transferring heat from the mounted electronic components. Additionally, VB200, manufactured using a special process, can provide products suitable for thin film areas where the use of liquid thermal materials is anticipated.
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basic information
- Excellent thermal conductivity in the thickness direction (Z-axis) - Achieved product provision with thin films through special processing - Maintains stable thermal resistance values even after heat cycles - Applicable to a wide range of uses from IC chips to heat sink heat dissipation - High durability derived from special elastomers
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Applicable to a wide range of uses from IC chips to heat dissipation from heat sinks.
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Company information
Zeon Chemical's High-Performance Materials Division offers a variety of high-performance film and sheet products, including the "Zeon AL Sheet," an adhesive-free, easy-to-peel adhesive sheet, as well as various fillers (metal-based, inorganic, and pigment-based) blended into these products. Additionally, we can also undertake contract manufacturing of PVC-based films and other materials. As a developed product, we are working on a UV-curable self-adhesive resin, which can serve as an alternative to areas currently using adhesives, such as OPP bags, and allows for the elimination of separators.