Oxygen inhibition measures!! It is possible to create a nitrogen atmosphere or a vacuum state inside the box.
Features - Compact and lightweight design that easily passes through an anti-chamber (pass box) - Ideal for transporting work between glove boxes - Real-time vacuum levels can be monitored with a digital Pirani vacuum gauge. This product can be customized with changes to specifications such as box size. We can create custom-made solutions according to your needs. Usage Suggestions - Transporting substances that are prone to oxidation - Transporting flammable substances - Transporting substances that need to avoid humidity - Transporting substances that need to avoid heating
Inquire About This Product
basic information
- Achieved vacuum level: 10Pa - Approximate dimensions: Effective internal dimensions: 130(D) × 160(W) × 125(H) mm External dimensions: 194D × 224W × 173H mm (excluding protrusions) - Approximate weight: 9.2 kg (including vacuum gauge and other equipment) Specifications other than the above can be custom-made upon request. The vacuum pump and nitrogen regulator are sold separately.
Price range
Delivery Time
Applications/Examples of results
- Work transport between glove boxes For purposes other than the above, we will conduct separate verification.
catalog（3）
Download All Catalogs
Company information
We solve your problems with bonding and sealing! - We propose a new bonding process that combines vacuum and atmosphere - Bonding of various shapes is possible. Prototyping and demo support are available, so please consult with us. At Joyo Engineering, as a top manufacturer of LCD bonding equipment and LCD cell gap formation equipment, we have produced many specialized devices that cater to various materials and process conditions, responding to our customers' needs. Based on numerous achievements, we have now released a new "vacuum bonding device." This device solves issues such as "air bubble inclusion in decorative panels with steps or slits," "design constraints of 2.5D/3D shapes," and "processing unevenness and positional deviation of thin substrates like films," enabling bonding of various shapes.