[Report] The Global Market for 3D IC and 2.5D IC Packaging
Product ID: 1270836 Publisher: MarketsandMarkets
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The market size for 3D IC and 2.5D IC packaging worldwide is expected to grow from 49.3 billion USD in 2023 to 82 billion USD by 2028, with a CAGR of 10.7% from 2023 to 2028. Key factors driving the growth of the 3D IC and 2.5D IC packaging market include the increasing trend of higher integration density and miniaturization of electronic devices, as well as the growing demand for consumer electronics and gaming devices.
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Publication Date: May 2, 2023 Publisher: MarketsandMarkets Page Information: English 218 Pages Table of Contents Chapter 1 Introduction Chapter 2 Research Methodology Chapter 3 Executive Summary Chapter 4 Key Insights Chapter 5 Market Overview Chapter 6 3D IC and 2.5D IC Packaging Market: By Packaging Technology Chapter 7 3D IC and 2.5D IC Packaging Market: By Application Chapter 8 3D IC and 2.5D IC Packaging Market: By End User Chapter 9 3D IC and 2.5D IC Packaging Market: By Region Chapter 10 Competitive Landscape Chapter 11 Company Profiles Chapter 12 Appendix *The table of contents and prices for this report are as of the time of publication. For the latest information, please contact us.
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The market research report is an informational document systematically describing market size and trends, based on research and analysis of market and technological trends conducted by overseas research publishing companies. In addition to quantitative data such as market trend analysis and future forecasts, it also includes details on the strategies of various companies and profiles of entering firms, which our customers utilize as part of their research on overseas markets and new technologies.
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