Active as lead-free solder plating! Used for canned containers and food utensils.
We would like to introduce O.M. Sangyo Co., Ltd.'s "Tin Plating." Tin has a low melting point of 232°C and excellent solderability, making it widely used for solder plating in the joining of connectors, crimp terminals, and various electronic components. Currently, lead-free solder plating options such as reflow tin plating, Sn-Cu alloy plating, Sn-Bi alloy plating, and Sn-Ag alloy plating are actively utilized. 【Types of Plating】 ■ Alkaline bath (Potassium tin bath) ■ Methanesulfonic acid bath (Alkanol sulfonic acid bath) ■ Sulfuric acid bath ■ Neutral bath (Carboxylic acid bath) *For more details, please refer to the PDF document or feel free to contact us.
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basic information
【Functions of Plating】 ■Solderability ■Corrosion Resistance ■Lubricity ■Low Contact Resistance ■Chemical Resistance *For more details, please refer to the PDF document or feel free to contact us.
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Applications/Examples of results
【Materials and Applications】 ■ Iron-based materials ■ Copper-based materials ■ Stainless steel materials ■ Printed circuit boards ■ Bumps ■ Hoop materials, coil materials *For more details, please refer to the PDF document or feel free to contact us.
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Company information
OM Sangyo Co., Ltd. is a "plating service industry" that can provide proposals, processing, management, and development all in one. Our motto is, "Let's provide the best 'plating service' to all our customers!" The plating industry involves taking care of our customers' valuable products, performing "plating" on them, and then returning them to the customers. What we can do while we have the products is referred to as "plating service," which includes technical capabilities, quality assurance, delivery responsiveness, environmental considerations, and cost reduction capabilities. It is our job to continuously improve the plating services that each customer requires and deliver the best plating service to our customers.