[English Market Research Report] IC Substrates in the Global PCB Market
Product ID: 1289720 Publisher: Lucintel
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The global PCB market from the perspective of IC substrate utilization is projected to have a CAGR of 14.2% from 2023 to 2028, reaching an estimated 15.3 billion USD by 2028. The main driving factors for this market include the expanding adoption of advanced packaging technologies such as wafer-level packaging and flip chip packaging, the increasing popularity of smart wearables like smartwatches and fitness bands, and the growing trend towards miniaturization. Opportunities in applications such as tablet PCs, smartphones, laptops, and wearable devices indicate a promising future for IC substrates in the global PCB market.
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Publication Date: May 1, 2023 Publisher: Lucintel Page Information: English 150 Pages Table of Contents Chapter 1 Executive Summary Chapter 2 IC Substrates in the Global PCB Market: Market Dynamics Chapter 3 Market Trends and Forecast Analysis from 2017 to 2028 Chapter 4 Regional Market Trends and Forecast Analysis from 2017 to 2028 Chapter 5 Competitive Analysis Chapter 6 Growth Opportunities and Strategic Analysis Chapter 7 Major Company Profiles *The table of contents and prices for this report are as of the time of publication. For the latest information, please contact us.
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Market research reports are informational documents systematically describing market size and trends, based on investigations and analyses of market and technological trends conducted by overseas research publishing companies. In addition to quantitative data such as market trend analysis and future forecasts, they also include details about the strategies of various companies and profiles of entering firms, which our customers utilize as part of their research on overseas markets and new technologies.
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