We measure electrical characteristics, brightness, wavelength, and ESD. Inspections are conducted in wafer and sheet states, accommodating various specifications such as top surfaces and upper and lower electrodes!
Measurement of electrical characteristics, brightness, wavelength, and ESD. Depending on the supply form, inspections can be conducted in wafer or sheet state, accommodating various specifications such as top surface and upper and lower electrodes. Additionally, if probe testing is required from mass production to small quantities of prototypes, please feel free to consult us. 【Overview】 ■ Top surface and upper/lower electrodes: 2 to 4 inches ■ Back surface: 2 to 4 inches ■ Integrating sphere: 2 to 4 inches *For more details, please refer to the PDF document or feel free to contact us.
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Hakodate Electronics Co., Ltd. is engaged in semiconductor assembly and LED testing, focusing on gold stud bump processing. We have established a consistent line for semiconductor back-end processes and an LED probe inspection sorting line, maintaining quality in an environment with temperature and humidity control and measures against electrostatic discharge. We cater to a wide range of needs from development prototypes to mass production, so please feel free to consult with us.