[Market Research Report] 3D IC and 2.5D IC Packaging Market
Product ID: 1284189 Publisher: Stratistics Market Research Consulting
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According to Stratistics MRC, the global 3D IC and 2.5D IC packaging market was valued at 49.3 billion USD in 2022 and is projected to reach 101 billion USD by 2028, growing at a CAGR of 12.7% during the forecast period. 2.5D/3D packaging is a method of housing multiple integrated circuits (ICs) within the same package. In the case of 2.5D, two or more active semiconductor chips are arranged on a silicon interposer, achieving a very high die-to-die interconnection density. Active chips in a three-dimensional structure are integrated through die stacking to achieve the shortest connectivity and the smallest package footprint. Due to the advantages of very high package density and excellent energy efficiency, 2.5D and 3D have recently been supported as suitable chiplet integration platforms.
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Publication Date: June 1, 2023 Published by: Stratistics Market Research Consulting Page Information: English 175+ Pages Table of Contents Chapter 1 Executive Summary Chapter 2 Preface Chapter 3 Market Trend Analysis Chapter 4 Porter's Five Forces Analysis Chapter 5 Global 3D IC and 2.5D IC Packaging Market: By Packaging Technology Chapter 6 Global 3D IC and 2.5D IC Packaging Market: By Application Chapter 7 Global 3D IC and 2.5D IC Packaging Market: By End User Chapter 8 Global 3D IC and 2.5D IC Packaging Market: By Region Chapter 9 Key Developments Chapter 10 Company Profiles *The table of contents and prices of this report are as of the time of publication. For the latest information, please contact us.
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Market research reports are informational documents systematically describing market size and trends, based on investigations and analyses of market and technological trends conducted by overseas research publishing companies. In addition to quantitative data such as market trend analysis and future forecasts, they also include details about the strategies of various companies and profiles of entering firms, which our customers utilize as part of their research on overseas markets and new technologies.
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