3.3V⇒ 3.3V、3.3V ⇒ 5V、3.3V ⇒ 6V
NVE's ILDC series is an insulated DCDC converter that is among the smallest in the world. It only requires three small chip magnetic capacitors, making it ideal for voltage conversion in compact, low-power devices. Thanks to the insulation technology developed from NVE's isolator products using polymer-ceramic composite materials, it boasts remarkable insulation performance. It can withstand insulation voltages of up to 600Vrms continuously, making it effective for GND loop noise prevention and electric shock protection. Originally developed for the secondary power supply of isolators, it is designed to be easy to use with isolators.
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basic information
● Ultra-compact package: DFN6 and SOIC16 ● Excellent insulation characteristics: Isolation technology using proven ceramic polymer composite barriers ● Robust: Built-in overcurrent protection circuit. Usable without derating up to an ambient temperature of 125°C ● Low ripple: Ripple below 5 mVp-p ● Minimal components: Only 3 external bypass capacitors required
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Applications/Examples of results
• Reduction of GND loops • RS-485 / RS-422 bus power • Isolated SPI / Microwire interface • Isolated ADC and DAC power • Medical systems requiring true 8mm creepage distance that meet "2 x MOPP" requirements
Line up（6）
| Model number | overview |
|---|---|
| ILDC11VE | 3.3V ⇒ 3.3V SOIC16W package |
| ILDC11-15E | 3.3V ⇒ 3.3V DFN6 package |
| ILDC12VE | 3.3V ⇒ 5V SOIC16W package |
| ILDC12-15E | 3.3V ⇒ 5V DFN6 package |
| ILDC13VE | 3.3V ⇒ 6V SOIC16W package |
| ILDC13-15E | 3.3V ⇒ 6V DFN6 package |
Company information
Our company provides high-quality services to client companies, from the development and design of industrial electronic devices to production at our own factory. We offer a one-stop service for all forms of DMS (Design & Manufacturing Service) tailored to customer needs, including the development and design of large-scale high-speed circuit boards and system racks, primarily focused on A/D, D/A, DSP, and FPGA-related products, as well as integration proposals with advanced overseas products.
