Introducing a heat exchanger for hydrogen compressors with a design pressure of 94 MPa and a heat resistance temperature of 190°C!
This time, we would like to introduce our high-pressure microchannel heat exchanger, the 'WEL-Cool(R) H2 Series,' which we are currently developing. It is a heat exchanger for hydrogen compressors that applies the technology of the heat exchanger H2C (pre-cooler) designed for hydrogen stations. Its rectangular shape makes it easy to install and contributes to space-saving. Additionally, we are developing two standard designs tailored for different applications: one for packaged hydrogen stations and another for medium-sized hydrogen stations. <Example of expected specifications> - Design pressure: 94 MPa - Heat resistance temperature: 190°C *For more details, please download the PDF or feel free to contact us.
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High-performance, compact, lightweight, and thermal management components provided through fine diffusion bonding technology, contributing to energy savings. Not just bonding, but also one-stop shopping for structural design, thermal fluid design, and more. We accommodate everything from prototype single items to mass production. Capable of fine three-dimensional structures, surface bonding, laminated bonding of thin plates, and bonding of dissimilar materials. Suitable for mass production of prototypes for 3D laminated structures and 3D printers. Applicable to hollow components, fine three-dimensional structures, high-pressure and high-efficiency heat exchangers with fine flow paths, high-efficiency heat sinks, reactors, mixers, and more. Extensive experience and proven results in providing solutions across various industries, including automotive, medical devices, semiconductor manufacturing equipment, food equipment, special inspection devices, power, and electrical/electronic components. For more details, please contact us.