<YAGEO NEXENSOS> Temperature sensor for inverters used in EV and HEV vehicles, with a sintered connection type. Capable of accurately measuring temperature even after a temperature rise.
The "Sintered Type SMD" is a platinum temperature sensor suitable for power electronics applications. It features a free positioning specification relative to the heat source/die. The surface metallization is compatible with aluminum thick wire bonding, and the backside is designed to accommodate a silver sintering process. Since the front and back are electrically insulated from each other, direct sintering can be performed without the need for additional structures on the substrate. 【Features】 ■ Temperature Coefficient (TC): 3850ppm/K ■ Temperature Range: -50℃ to +200℃ (and above) ■ Platinum (Pt) circuit ■ RoHS compliant *For more details, please refer to the PDF document or feel free to contact us.
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【Yageo Nexsensos Solution】 ■ Suitable thermal bonding through silver sintering (excellent responsiveness) ■ Excellent long-term stability and high-precision temperature measurement due to platinum characteristics ■ Operating temperature above +200°C (considering bonding technology) ■ Individual conductor tracks are unnecessary as the substrate and bond pads are insulated, allowing for direct positioning of the heat source/die ■ Assembly through silver sintering ■ Fast and reliable standard bonding technology (e.g., Heraeus Al-thick wires) *For more details, please refer to the PDF document or feel free to contact us.
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【Purpose】 ■Mass production applications for automatic mounting of printed circuit boards *For more details, please refer to the PDF materials or feel free to contact us.
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Platinum temperature sensor for power electronics

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The origin of Tokin lies in "materials." Currently, human society is evolving towards a global ubiquitous society due to the advancement of information and communication technology. We believe that our mission is to create key devices that drive this innovation by tracing back to the materials. Based on our unique material development capabilities and high-density device manufacturing power, we aim to create devices that govern the flow of society. With this, we hope to contribute, albeit modestly, to the realization of a vibrant society grounded in advanced information and communication technology.