DFI, extended temperature support, fanless design, 2x Intel GbE, 4x USB 3.1, 2x USB 2.0, supports 2x COM.
Features ■ Width 175 × Height 69.4 × Depth 120 mm (1 Storage: 1 x M.2 SSD) ■ Width 175 × Height 90.4 × Depth 120 mm (3 Storage: 1 x M.2 SSD + 2 x 2.5” bay) ■ Weight (kg) 3.5 kg (1 Storage), 3.8 kg (3 Storage) ■ Equipped with 9th/8th generation CPU L ■ 2 x 260-pin DDR4 2666MHz SODIMM (up to 64GB) ■ Supports maximum resolution 4K with 2 independent display outputs (2 x HDMI) ■ Supports 2 x Intel GbE, 4 x USB 3.1, 2 x USB 2.0, 2 x COM ■ Operating temperature range -20 to 60°C (cTPU 15W) ■ Mounting method supports Wall Mount, VESA mount 75x75/100x100 cm (optional) ■ Compatible with Windows 10 IoT Enterprise 2019 LTSC + RS5, Windows 10 Professional
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Specifications ■CPU 9th/8th Generation CPU LGA 1151 Socket Intel Core i7-9700TE/i5-9500TE/i3-9100TE/i7-8700T/i5-8500T/i3-8100T/Pentium G5400T/Celeron G4900T processors ■Chipset Intel C246/Q370/H310 Chipset ■Memory 2 x 260-pin DDR4 2666MHz SODIMM (up to 64GB) ■Expansion Slots 1 x M.2 2280 M key (PCIe x4/SATA 3.0), 1 x M.2 2230 E key (PCIe x1/USB2.0), WiFi ■I/O Connectors 2x Intel GbE, 4x USB 3.1, 2x USB 2.0, 2 x COM, 2 x HDMI ■Power 12V DC ■Operating Temperature -20 to 60°C (cTPU 15W), -5 to 45°C (TDP 35W) ■Certifications: FCC, CE Class B, RoHS, WEEE, UKCA
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Delivery Time
※It may vary depending on the quantity and timing, so please feel free to contact us.
Applications/Examples of results
For machine, factory, and building automation/monitoring systems.
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Currently, Taiwan has become a global supply base for industrial electronic equipment, and we aim to contribute to the development of Japanese industry by providing excellent industrial electronic equipment from Taiwan to Japanese engineers. As a specialized trading company for industrial electronic equipment, we will supply the necessary industrial electronic devices (LCD displays, LCD modules, embedded PCs, AI embedded PCs, panel PCs, CPU boards, measurement and control boards, network devices, video equipment, GPS devices, wireless transmission devices, IoT sensors) to engineers.